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State-of-the-art dual-tower design with 6 heatpipes and 2 fans provides class-leading cooling performance for overclocking or near-silent systems. DirectCompress Soldering for 10% more contact surface compared to traditional soldering, and the more contact surface the faster the heat conduction. Heatpipe Displacement Optimization allows for better and more evenly spread heat conduction on the fins compared to traditional linear alignment. Heatpipe Convex-Align System allows for more heatpipes in a given area, optimized heatpipe placement in the copper base, and improved alignment with your CPU. Supports Intel Socket 130W LGA20XX/LGA1366/LGA115X/LGA775 and AMD Socket 125W AM4/AM3+/AM3/AM2+/AM2/FM2+/FM2/FM1
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